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YM05S05 DC-DC Converter
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 5 A
Data Sheet
The
Products: Y-Series
Features
? RoHS lead free and lead-solder-exempted products
are available
? Delivers up to 5 A
? No derating up to 85 ? C
? Surface-Mount package
? Industry-standard footprint and pinout
? Small size and low profile:
o 0.80” x 0.45” x 0.247”
o 20.32 mm x 11.43 mm x 6.27 mm
? Weight: 0.08 oz [2.22 g]
Applications
? Coplanarity less than 0.003”, maximum
?
?
?
?
?
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
? Synchronous Buck Converter topology
? Start up into pre-biased output
? No minimum load required
? Programmable output voltage via external resistor
? Operating ambient temperature: -40 °C to 85 °C
? Remote ON/OFF
? Fixed frequency operation
Benefits
? High efficiency – no heat sink required
? Reduces total solution board area
? Tape and reel packing
? Compatible with pick & place equipment
? Minimizes part numbers in inventory
? Auto-reset output over-current protection
? Auto-reset over-temperature protection
? High reliability, MTBF approx. 69 Million Hours
calculated per Telcordia TR-332, Method I Case 1
? All materials meet UL94, V-0 flammability rating
? UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YM05S05 non-isolated dc-dc converters deliver up to 5 A of output current in an
industry-standard surface-mount package. Operating from a 3.0 – 5.5 V input, these converters are ideal choices
for Intermediate Bus Architectures where Point-of-Load (POL) power delivery is generally a requirement. They
provide an extremely tight regulated programmable output voltage from 0.7525 V to 3.63 V.
The Y-Series of converters provides exceptional thermal performance, even in high temperature environments
with minimal airflow. No derating is required up to 85 ? C, even without airflow at natural convection. This
performance is accomplished through the use of advanced circuitry, packaging and processing techniques to
achieve a design possessing ultra-high efficiency, excellent thermal management and a very low-body profile.
The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
ZD-01978 Rev. 3.2, 18-Jun-10
www.power-one.com
Page 1 of 24
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